Hi all,

talking LGA s.  One company has just informed me that their LGA test has gon 
some 4,000 times -40/+125 C with only one failure. Several hundred LGAs were 
tested and there was only on little failure. This is quite opposite to many 
MIL companies, who ban LGAs. It should be pointed out, that the packages 
were rather small, less than 100  I/O s and the board was <  1 mm thick.

Inge




----- Original Message ----- 
From: "Leif Erik Laerum" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, March 20, 2009 2:33 PM
Subject: Re: [TN] LGA acceptance


> Tan,
>
> I beleive this is covered by section 8.2.13 (PQFN).
>
> Leif Erik Laerum
> Quality Assurance Manager
> Texas Memory Systems
> [log in to unmask]
> Tel: (713) 266-3200 x468
> www.texmemsys.com
>
>
>
> Tan Geok Ang wrote:
>> Hi All, base on IPC-A-610D, there is no explicit requirement for LGA, all 
>> it says about Surface Mount Area Array is "for devices with solder balls 
>> that collapse during reflow". Is there any IPC standard/specification 
>> define the void on LGA? Thank you all and have a nice day!
>>
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