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Subject:	Re: solder fatigue analysis for slowly changing thermal environment
From:	Werner Engelmaier /* <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Mon, 27 Apr 2009 13:16:28 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (50 lines)

 Hi Kevin,
Have passport, will travel—I need a passport to Boston since currently I am in Vienna.
All I need to go anywhere is a proper invitation—in many places companies make internal arrangements for workshops, but invite outsiders into their conference facilities to spread the costs around. This is particularly important nowadays, since many organizations, like IPC, have canceled all but their main conferences. So industry needs to take things into their own hands and organize workshop presentations; of course, I will help.

Werner


 


 

-----Original Message-----
From: Kevin Glidden <[log in to unmask]>
To: [log in to unmask]; Werner Engelmaier /* <[log in to unmask]>
Sent: Mon, 27 Apr 2009 9:10 am
Subject: Re: solder fatigue analysis for slowly changing thermal environment










Hi Werner,
How did I know that would be the answer?!  Have you posted an updated 
schedule for 2009?   Any plans to hit the Northeast (Boston)?  All that time in 
Moscow and Rumania, but here in the US you hit Orlando, Dallas, and Las 
Vegas!  Put on the ushanka and come North! ;)





 


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