ENEPIG offers a lot of advantages , but is not without limitations.
 
The deposition of the Pd is electroless leaving no chance for any nickel  
corrosion. 
 
It is a great contacting surface and is both gold wire bondable for Au and  
Al wire, depending on the Pd and the Au thickness deposited.
 
The presence of Pd in solder joint is a source of weakness if the soldering 
 material is eutectic solder. However if the solder is LF SAC type alloy 
the  solder joint is extremely robust and of very high reliability. The 
presence of  the Cu in the alloy is integral to joint strength.
 
I guess if aerospace is still in the realm of eutectic solder, ENEPIG would 
 not be the first choice, ENIG would be a better choice.
 
 
Regards
George Milad
George Milad
National Accounts  Manager for Technology
Uyemura International Corp (UIC)
249 Town Line Rd  
Southington CT 06489
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