Hi Amol

Why only dip & look? Why not force measurement?

Graham Naisbitt
Gen3 Systems
www.gen3systems.com

On 23 Apr 2009, at 16:45, Kane, Amol (349) wrote:

> Thanks Denny. Specifically, I was looking for the names of equipment  
> manufacturers in the US who manufacture Steam Ageing chambers and  
> the solderability testing equipment (dip and look)
>
> Thanks,
> Amol
>
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Thursday, April 23, 2009 11:03 AM
> To: [log in to unmask]; Kane, Amol (349)
> Subject: Re: [TN] IPC/EIA-J-STD 002 Steam Ageing
>
> Amol,
>
> You are going to get it from Dave Hillman, chairman of IPC 002!!!   
> He likes to refer to it as "steam conditioning" or  "steam  
> stressing".  People try to equate performanc in steam stressing to  
> the aging of the component in storage.  Storage in Singapore is far  
> different from storage in Winnepeg.
>
> Is there some part of this paragraph on equipment that is a problem?
> 3.3.1 Steam Conditioning Apparatus The steam conditioning chamber  
> shall be constructed of non-corrodible materials such as
> borosilicate glass, quartz glass, stainless steel or PTFE. The  
> specimen holder shall be non-reactive to prevent galvanic corrosion.  
> The
> container should be insulated. The steam temperature at the  
> conditioning level shall be maintained per the requirements of Table  
> 3-2.
> Table 3-2 Steam Temperature Requirements
> Altitude Average Local
> Boiling Point °C
> Steam Temperature
> Limits °C
> 0-305 m 100 93 ± 3
> 305-610 m 99 92 ± 3
> 610-914 m 98 91 ± 3
> 914-1219 m 97 90 ± 3
> 1219-1524 m 96 89 ± 3
> 1524-1829 m 95 88 ± 3
> A safe means to prevent excessive pressure and a means of  
> maintaining adequate water level shall be provided. Neither shall  
> cause
> the vapor to cool below the specified temperature. Condensate shall  
> drip freely back to the water. Care should be taken to minimize
> contact between the condensate and the specimens.
>
> Fin ally, do you have comment on either dip-and-look or wetting  
> balance to measure solderability?
>
> Denny Fritz
> MacDermid, Inc
> -----Original Message-----
> From: Kane, Amol (349) <[log in to unmask]>
> To: [log in to unmask]
> Sent: Thu, 23 Apr 2009 9:37 am
> Subject: [TN] IPC/EIA-J-STD 002 Steam Ageing
>
> Dear Technetters,
>
> How are people in the industry complying with the category 3, test  
> method A, B
>
> or C of this requirement for high reliability applications? the 002  
> standard
>
> calls out for steam ageing and then solderability testing for  
> components. What
>
> equipment is being used for steam ageing and solderability testing?  
> I would
>
> appreciate any direction on this matter (on the forum or offline if  
> somebody so
>
> desires)
>
>
>
> Thanks,
>
> Amol
>
>
>
>
>
>
>
>
>
>
>
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