Someone at a NEPCON, NCMS or IPC conference (he can't


Lee,



Someone at a NEPCON, NCMS or IPC conference (he can't remember which

because it was many years ago) made a statement that "Pd SUCKS".  A year

later he had to modify that statement to "Electroless Processes SUCK"

because he had personal experiences with solder joint reliability using

full-built Electroless copper with OSP, Electroless Nickel Immersion

gold, and Electroless Nickel Electroless Palladium Immersion Gold.  That

person isn't a chemist but he dealt with many board shop chemical

process engineers that told him that Electrolytic processes were

relatively easy to control as long as you can deal with the current

density issue and Immersion processes were relatively easy to control in

that they are self limiting but Electroless processes were the most

difficult to control.  I guess if one really had a need for ENEPIG they

would use it but the person that said "Electroless Processes SUCK" would

most likely tell you that he would be concerned about it for high

reliability aerospace use.



Regards,

George

George M. Wenger

Andrew Wireless Solutions

Senior Principal FMA / Reliability Engineer

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 [Office]  (732) 309-8964 [Cell]

[log in to unmask]

 

-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman

Sent: Thursday, April 23, 2009 2:11 PM

To: [log in to unmask]

Subject: [TN] Electroless Nickel Electroless Palladium Immersion Gold

(ENEPIG)



Does anyone have any opinions of using Electroless Nickel Electroless

Palladium Immersion Gold (ENEPIG) as a board finish for high reliability

aerospace applications?



You can contact me off line if necessary...



Thanks again.



Lee Whiteman, PMP

Senior Member Engineering Staff

L-3 Communications East

Telephone: (856) 338-3508

FAX: (856) 338-2906

E-Mail: [log in to unmask]

 



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