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April 2009

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 23 Apr 2009 23:11:52 -0500
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Hi Amol! Yes, the more appropriate term is "steam conditioning". Look in 
the JSTD-002 appendices, there is a listing of the equipment producers 
(Appendix E I think).

Dave



"Kane, Amol (349)" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
04/23/2009 10:45 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Kane, Amol (349)" <[log in to unmask]>


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Subject
Re: [TN] IPC/EIA-J-STD 002 Steam Ageing






Thanks Denny. Specifically, I was looking for the names of equipment 
manufacturers in the US who manufacture Steam Ageing chambers and the 
solderability testing equipment (dip and look)

Thanks,
Amol

From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, April 23, 2009 11:03 AM
To: [log in to unmask]; Kane, Amol (349)
Subject: Re: [TN] IPC/EIA-J-STD 002 Steam Ageing

Amol,

You are going to get it from Dave Hillman, chairman of IPC 002!!!  He 
likes to refer to it as "steam conditioning" or  "steam stressing". People 
try to equate performanc in steam stressing to the aging of the component 
in storage.  Storage in Singapore is far different from storage in 
Winnepeg.

Is there some part of this paragraph on equipment that is a problem?
3.3.1 Steam Conditioning Apparatus The steam conditioning chamber shall be 
constructed of non-corrodible materials such as
borosilicate glass, quartz glass, stainless steel or PTFE. The specimen 
holder shall be non-reactive to prevent galvanic corrosion. The
container should be insulated. The steam temperature at the conditioning 
level shall be maintained per the requirements of Table 3-2.
Table 3-2 Steam Temperature Requirements
Altitude Average Local
Boiling Point °C
Steam Temperature
Limits °C
0-305 m 100 93 ± 3
305-610 m 99 92 ± 3
610-914 m 98 91 ± 3
914-1219 m 97 90 ± 3
1219-1524 m 96 89 ± 3
1524-1829 m 95 88 ± 3
A safe means to prevent excessive pressure and a means of maintaining 
adequate water level shall be provided. Neither shall cause
the vapor to cool below the specified temperature. Condensate shall drip 
freely back to the water. Care should be taken to minimize
contact between the condensate and the specimens.

Fin ally, do you have comment on either dip-and-look or wetting balance to 
measure solderability?

Denny Fritz
MacDermid, Inc
-----Original Message-----
From: Kane, Amol (349) <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 23 Apr 2009 9:37 am
Subject: [TN] IPC/EIA-J-STD 002 Steam Ageing

Dear Technetters,

How are people in the industry complying with the category 3, test method 
A, B

or C of this requirement for high reliability applications? the 002 
standard

calls out for steam ageing and then solderability testing for components. 
What

equipment is being used for steam ageing and solderability testing? I 
would

appreciate any direction on this matter (on the forum or offline if 
somebody so

desires)



Thanks,

Amol











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WARNING:  Export Control 
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International Traffic in Arms Regulations (ITAR), and subject to the 
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