Hello technet

I am reviewing an application involving PoP (14mm package on package) 
placed on the side A of the board, side B involves placement of multiple SMT 
connectors (USB etc) therefore it's necessary to process them last. 

My question is whether anyone sees a problem with the PoP device on side A 
going through a 2nd time reflow during side B processing? Would I need to 
utilize a reflow carrier to shield side A to avoid secondary reflow of the PoP 
device?

Any input is appreciated. Thanks.

Peter

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