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April 2009

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Subject:
From:
Lee Whiteman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 23 Apr 2009 15:51:51 -0400
Content-Type:
text/plain
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text/plain (93 lines)
SMT / Soldering

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Thursday, April 23, 2009 3:50 PM
To: [log in to unmask]
Subject: Re: [TN] Electroless Nickel Electroless Palladium Immersion
Gold (ENEPIG)

Lee,

Wire bonding or SMT/soldering?  My assumption is the latter, but thought
I
would ask anyway.

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Thursday, April 23, 2009 2:11 PM
To: [log in to unmask]
Subject: [TN] Electroless Nickel Electroless Palladium Immersion Gold
(ENEPIG)

Does anyone have any opinions of using Electroless Nickel Electroless
Palladium Immersion Gold (ENEPIG) as a board finish for high reliability
aerospace applications?

You can contact me off line if necessary...

Thanks again.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
 

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