Thanks Denny. Specifically, I was looking for the names of equipment manufacturers in the US who manufacture Steam Ageing chambers and the solderability testing equipment (dip and look)
Thanks,
Amol
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, April 23, 2009 11:03 AM
To: [log in to unmask]; Kane, Amol (349)
Subject: Re: [TN] IPC/EIA-J-STD 002 Steam Ageing
Amol,
You are going to get it from Dave Hillman, chairman of IPC 002!!! He likes to refer to it as "steam conditioning" or "steam stressing". People try to equate performanc in steam stressing to the aging of the component in storage. Storage in Singapore is far different from storage in Winnepeg.
Is there some part of this paragraph on equipment that is a problem?
3.3.1 Steam Conditioning Apparatus The steam conditioning chamber shall be constructed of non-corrodible materials such as
borosilicate glass, quartz glass, stainless steel or PTFE. The specimen holder shall be non-reactive to prevent galvanic corrosion. The
container should be insulated. The steam temperature at the conditioning level shall be maintained per the requirements of Table 3-2.
Table 3-2 Steam Temperature Requirements
Altitude Average Local
Boiling Point °C
Steam Temperature
Limits °C
0-305 m 100 93 ± 3
305-610 m 99 92 ± 3
610-914 m 98 91 ± 3
914-1219 m 97 90 ± 3
1219-1524 m 96 89 ± 3
1524-1829 m 95 88 ± 3
A safe means to prevent excessive pressure and a means of maintaining adequate water level shall be provided. Neither shall cause
the vapor to cool below the specified temperature. Condensate shall drip freely back to the water. Care should be taken to minimize
contact between the condensate and the specimens.
Fin ally, do you have comment on either dip-and-look or wetting balance to measure solderability?
Denny Fritz
MacDermid, Inc
-----Original Message-----
From: Kane, Amol (349) <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 23 Apr 2009 9:37 am
Subject: [TN] IPC/EIA-J-STD 002 Steam Ageing
Dear Technetters,
How are people in the industry complying with the category 3, test method A, B
or C of this requirement for high reliability applications? the 002 standard
calls out for steam ageing and then solderability testing for components. What
equipment is being used for steam ageing and solderability testing? I would
appreciate any direction on this matter (on the forum or offline if somebody so
desires)
Thanks,
Amol
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