Richard, are experiences are simila
Ditto. Ditto. Ditto. Ditto.
Richard, are experiences are similar. The jury is only out for those
who haven't used ImAg. For those of us who have the proof has been the
reliability of our products.
Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell]
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Thursday, April 16, 2009 3:45 PM
To: [log in to unmask]
Subject: Re: [TN] Gold/Tin Intermetallics, why are we afraid?
Ditto. Ditto. Ditto.
Chris,
About your statement: "As far as I know, the jury is still out on ImAg,
ImSn as final via finish. Considering creep, tarnish, whiskers,
porosity... I wouldn't go there".
Please provide documentation on these issues. I have not seen that here
in the U.S.
We have built a lot of high-reliability Class 3 CCAs with IAg used as a
final finish here at GD. We are currently building more than one
contract that requires a 20-year life with 99.95% reliability utilizing
a very large 48 layer PWB. It costs over $100,000 for 1 (one) PWB.
The surface finish is .....drum roll, sounds of cans of Mountain Dew
being snapped open.....Immersion Silver.
Outside of GD, I have seen thousands upon thousands of IAg boards used
for medical, telecommunications, and industrial applications, with very
few (I can count them on one hand) via issues related to the finish. Of
those, none were associated with a proven finish product such as
Sterling and were nearly always the result of other fabrication issues
unrelated to the finish.
I have yet to see an IAg finished board with a via failure attributed to
porosity, tin whiskers, creep, etc., except where there were design
issues unrelated to the surface finish.
On the other hand, I have seen ENIG PWBs with via cracks, albeit rarely.
But I have seen many more issues with ENIG SJs that dwarf via
reliability issues in comparison.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, April 16, 2009 2:32 PM
To: [log in to unmask]
Subject: Re: [TN] Gold/Tin Intermetallics, why are we afraid?
Hi Joyce - my response would "it depends" (and Doug gets another Diet
Mt.
Dew) as Rockwell Collins utilizes immersion silver pwb surface finishes
on
many IPC Class 3 type products with no reliability issues.
Dave
Joyce Koo <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
04/15/2009 04:11 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Joyce Koo <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] Gold/Tin Intermetallics, why are we afraid?
"ImAG finishes have a 12-month shelf life in a controlled environment
(<35[degrees]C/<85[degrees] RH), which can be significantly shortened
when exposed to air pollution with high sulfur and chlorine content.
Silver embrittlement Embrittlement
A general set of phenomena whereby materials suffer a marked decrease in
their ability to deform (loss of ductility) or in their ability to
absorb energy during fracture (loss of toughness), with little change in
other mechanical properties, such ([Ag.sub.3]Sn intermetallics) of
solder joints may occur when the finish thickness exceeds IPC-4553
recommendations and Pb-free, high silver content solders are used. ImAG
is not recommended for high-reliability assemblies that must meet
IPC-6010 Class 3 requirements, but is acceptable for Classes 1 and 2."
http://www.thefreelibrary.com/Will+discoloration+tarnish+ImAg+reliabilit
y%3F+Watch+for+silver...-a0193896272
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier /*
Sent: Wednesday, April 15, 2009 4:34 PM
To: [log in to unmask]
Subject: Re: [TN] Gold/Tin Intermetallics, why are we afraid?
Hi Vlad,
I cannot comment on your specific case, but look at the pics below to
see
Ag-embrittlement.
Sorry 'Netters, IPC strips pics.
Werner
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