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April 2009

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 16 Apr 2009 16:07:49 -0500
Content-Type:
text/plain
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text/plain (67 lines)
The answer is 
E. Improve your X-ray and visual inspection processes in order to detect
the solder short prior to shipping and then you can do your 8D and
Ishikawa diagram, fishbone analysis, 5 whys, etc., and your customer is
happy with the excellent quality product you provide.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of bob wettermann
Sent: Thursday, April 16, 2009 4:00 PM
To: [log in to unmask]
Subject: [TN] Determining Root Cause

Dear Technetters:

Here's a situation where your opinions would be helpful:

Assume
your company  have shipped a PWB to a customer and the customer
determines a functional failure and via XRAY determines that there was
problem via a solder short. As the builder you review the XRAY image
and you confirm that it is indeed a short. The customer asks you for an
8D analysis. You politely request that the board be returned so that
you can ask the 5 "Whys" or generate an "Ishikawa diagram" or a get to a
root cause.

Upon asking this question the customer indicates that the board is no
longer available. Do you:

A. Tel the customer that without the actual board (1 out of a lot size
of 25) the root cause analysis is not possible and you cannot perfom an
8D
B. Ask for the balance of the lot back to see and begin the root
analysis and trust that you can actually get to a root cause
C. Guess at a root cause 
D. Do not answer your phone

Regards 
 Bob Wettermann
PH 847-767-5745

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