TECHNET Archives

April 2009

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Thu, 16 Apr 2009 10:11:51 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (70 lines)
Graham,
We don't and we don't even recommend it for commercial apps...
BUT... AGAIN...  It all depends ...

You might want to use it in a none-critical redundant secondary system...
But even then with care...

Apart from the issues already mentioned... The critical element that the solder joint is a surface adhesion only joint whose quality can not be determined without damage to the joint... Yes you can x-ray it or use acoustical microscopy to determine the voiding but this will not determine the joint strength just that you have maximized the joint surface area...

Paul

Paul Edwards

Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: Thursday, April 16, 2009 3:32 AM
To: [log in to unmask]
Subject: [TN] LGAs in a military environment?

Hello Technet!
One of our designers is advocating using a LGA component in a military
product.  Anyone out there doing it?  I'm wondering (worried) about the
reliability since it has a very low standoff.  And cleaning issues?

An example of the parts I'm referring to:
http://www.linear.com/designtools/packaging/lga/05081807_a_lga66.pdf
A Linear Technologies p/n LTM4604

regards,

Graham Collins
Halifax Production Engineering
(902) 873-2000 ext. 6215


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

==============================================================================

This email and any attachments thereto may contain private, confidential, and
privileged material for the sole use of the intended recipient. Any review, copying,
or distribution of this email (or any attachments thereto) by others is strictly prohibited.
If you are not the intended recipient, please contact [log in to unmask]
immediately and permanently delete the original and any copies of this email and
any attachments thereto. 

==============================================================================


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2