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| Date: | Thu, 16 Apr 2009 11:25:04 -0400 |
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What am I going to do with this one then? I have to assemble 3 of them on a fairly large 14 layers RoHS board...
http://www.linear.com/pc/downloadDocument.do?navId=H0,C1,C1010,C1778,C1764,P60551,D26185
Please also note the "wise" layout suggested on page 19. Does anybody think about us assemblers?
Regards,
Ioan Tempea, ing.
t : 450-967-7100 ext : 244
[log in to unmask]
www.digico.cc
P N'imprimer que si nécessaire - Print only if you must
-----Message d'origine-----
De : Stadem, Richard D. [mailto:[log in to unmask]]
Envoyé : 16 avril 2009 11:11
À : [log in to unmask]
Objet : Re: [TN] LGAs in a military environment?
Bev's assessment is right on.
The particular component that Graham's designer wishes to use is a real
"problem child" from a long term reliability standpoint, not only
because of the fact that it is an LGA with very large delta CTE between
component and substrate, but also from the standpoint of having a lot of
connections underneath, which reduces cleanability even more.
And no-clean fluxes typically don't completely activate underneath a
package of this type, even if it were able to be used.
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