I think both you and Vladimir are correct. If the bond
Ingemar,
I think both you and Vladimir are correct. If the bond sits are room
temperature without any power cycling or mechanical stress it probably
won't degrade. I assume Vladimir has seen the same kinds of failures
I've seen and there has always been a thermal and/or mechanical stress
associated with the failures.
Regards,
George
George M. Wenger
Andrew Wireless Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell]
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
Sent: Tuesday, April 14, 2009 5:15 PM
To: [log in to unmask]
Subject: Re: [TN] Gold/Tin Intermetallics, why are we afraid?
You mean that such a bond degrades even if just being in constant room
temperature and no power switching?
Inge
----- Original Message -----
From: <[log in to unmask]>
To: "TechNet E-Mail Forum" <[log in to unmask]>; "Inge"
<[log in to unmask]>
Sent: Tuesday, April 14, 2009 11:07 PM
Subject: Re: [TN] Gold/Tin Intermetallics, why are we afraid?
> Hi Inge,
>
> Yes, the intermetallics itself is strong, BUT it doesn't count, as all
> failures I've seen goes at the tin/intermetallics interface. The
larger
> were the platelets, the worse it looked.
>
> Regards,
>
> Vladimir
> ------Original Message------
> From: Inge
> Sender: TechNet
> To: [log in to unmask]
> ReplyTo: TechNet E-Mail Forum
> ReplyTo: Inge
> Sent: Apr 14, 2009 16:55
> Subject: [TN] Gold/Tin Intermetallics, why are we afraid?
>
> These infamous IMCs are like parias or ghosts in most people's mind in
our
> business. I shocked our production guys recently by giving the advice
to
> let
> the boards go on. Large crystals and bad looking. But I always try to
> avoid
> exaggerations. If no serious temp changes are predicted, nor any
severe
> power switching, why rework and risk introducing failures? The actual
> components were very hard to rework, the cost had been unacceptable. I
can
> see many of you get the coffee wrong. I don't mean to spread quality
> distractions, I talk about very few boards and a unique situation. My
> statement was based on the fact that a gold tin intermetallic bond is
> extremly strong and can last long, if not exposed to what I pointed at
> earlier. I expect to be hammered down in the shop floor until only the
> nose
> is visible....
>
> Inge
>
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