Agree. If you are the design authority and known the limits of the application environment.  The only danger is someone in thye future will copy it without such a knowledge.  Open a coomon law is the danger.  
--------------------------
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Tue Apr 14 16:55:52 2009
Subject: [TN] Gold/Tin Intermetallics, why are we afraid?

These infamous IMCs are like parias or ghosts in most people's mind in our 
business. I shocked our production guys recently by giving the advice to let 
the boards go on. Large crystals and bad looking. But I always  try to avoid 
exaggerations. If no serious temp changes are predicted, nor any severe 
power switching, why rework and risk introducing failures?  The actual 
components were very hard to rework, the cost had been unacceptable. I can 
see many of you get  the coffee wrong. I don't mean to spread quality 
distractions, I talk about very few boards and a unique situation. My 
statement was based on the fact that a gold tin intermetallic bond is 
extremly strong and can last long, if not exposed to what I pointed at 
earlier. I expect to be hammered down in the shop floor until only the nose 
is visible....

Inge

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