You mean that such a bond degrades even if just being in constant room 
temperature and no power switching?
Inge


----- Original Message ----- 
From: <[log in to unmask]>
To: "TechNet E-Mail Forum" <[log in to unmask]>; "Inge" 
<[log in to unmask]>
Sent: Tuesday, April 14, 2009 11:07 PM
Subject: Re: [TN] Gold/Tin Intermetallics, why are we afraid?


> Hi Inge,
>
> Yes, the intermetallics itself is strong, BUT it doesn't count, as all 
> failures I've seen goes at the tin/intermetallics interface. The larger 
> were the platelets, the worse it looked.
>
> Regards,
>
> Vladimir
> ------Original Message------
> From: Inge
> Sender: TechNet
> To: [log in to unmask]
> ReplyTo: TechNet E-Mail Forum
> ReplyTo: Inge
> Sent: Apr 14, 2009 16:55
> Subject: [TN] Gold/Tin Intermetallics, why are we afraid?
>
> These infamous IMCs are like parias or ghosts in most people's mind in our
> business. I shocked our production guys recently by giving the advice to 
> let
> the boards go on. Large crystals and bad looking. But I always  try to 
> avoid
> exaggerations. If no serious temp changes are predicted, nor any severe
> power switching, why rework and risk introducing failures?  The actual
> components were very hard to rework, the cost had been unacceptable. I can
> see many of you get  the coffee wrong. I don't mean to spread quality
> distractions, I talk about very few boards and a unique situation. My
> statement was based on the fact that a gold tin intermetallic bond is
> extremly strong and can last long, if not exposed to what I pointed at
> earlier. I expect to be hammered down in the shop floor until only the 
> nose
> is visible....
>
> Inge
>
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