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April 2009

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 13 Apr 2009 12:50:08 -0500
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Hi, Amol.
The process control for solder paste printing is the paste print
inspection, which I assume you track the results. If your CpK results
are within the UCL and LCL limits without additional paste rework
needed, you should not need to replace it, unless there is obvious
damage to the webbing around the foil or some other compelling reason. 
There is always some risk involved with tooling replacement, including
stencils. Better to leave the process alone if it is working. When you
do decide to replace it, don't throw away the old one until you have
validated the new stencil, again using paste print inspection results.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Monday, April 13, 2009 12:09 PM
To: [log in to unmask]
Subject: [TN] Stencil Life

Dear Technetters,
Do anyone of you out there have a set value (time, # of prints etc.,)
that is used to replace a stencil with a new one?. I know "it depends"
on a large # of factors (stencil material, print speed, squeegee type,
print pressure, aperture size etc.), but is there some method to the
madness or is stencil replacement essentially a "as needed" item?

Thanks,
Amol



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