http://www.merix.com/HDI+Structures.aspx?id=3&rid=

Merix has some pretty good papers.
IPC-4761 is pretty good as well


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kevin Glidden
Sent: Monday, April 13, 2009 9:45 AM
To: [log in to unmask]
Subject: [TN] Info on LPI tenting of vias, both sides


Hello everyone,
 
I am looking for information on the potential pitfalls of using LPI via
tenting on both sides, leaving an air pocket in the vias.  Application is
NOT Pb-Free.
 
I located this article description, and wanted to see if anyone had it, but
other information, inputs, or articles are also welcome:
 

Title: An Evaluation of Via Hole Tenting with Solder Mask Designed to Pass
MIL-P-55110D Thermal Shock Requirements


Author(s): J.J. Davignon, F. Gray


Journal:  <http://www.emeraldinsight.com/0305-6120.htm> Circuit World

 
Thanks!
 

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