Too many rewrites of IPC-6012, I'm starting to fray. Thanks for noticing.
Dewey
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Lance A Auer
Sent: Thursday, April 30, 2009 1:50 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Reflow testing
Dewey,
You are in rare form! Again.
Lance
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]>
04/30/2009 11:47 AM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [IPC-600-6012] Reflow testing
To cause stress
Without a mess
Nothing says lovin
Like specs on a oven
Dewey
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of John Perry
Sent: Thursday, April 30, 2009 11:36 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Reflow testing
Hi Wendi and All,
Method 2.6.27 should be released sometime next week on the IPC-TM-650
website. I'm also putting together a web page of providers of thermal
ovens that can meet the profiles in that method.
Regards,
John Perry
Technical Project Manager
IPC - Association Connecting Electronics Industries®
3000 Lakeside Drive # 309S
Bannockburn, IL 60015-1249 USA
+1 847-597-2818 (tel)
+1 847-615-7105 (fax)
+1 847-615-7100 (Main)
[log in to unmask]
www.ipc.org
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Whittaker,
Dewey (EHCOE)
Sent: Thursday, April 30, 2009 1:07 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Reflow testing
It is not officially released. Ask John Perry for ERD.
Dewey
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Wendi Boger
Sent: Thursday, April 30, 2009 10:59 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Reflow testing
Thanks Dewey.
Do you know if the Test Method is release?
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Whittaker,
Dewey (EHCOE)
Sent: Thursday, April 30, 2009 10:25 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Reflow testing
Wendi,
The procurement documentation shall specify the thermal stress test method
to be used to meet the requirement of 3.6.1. Selection shall be from
those depicted in 3.6.1.1, 3.6.1.2 and 3.6.1.3. If not specified (see
5.1), the default shall be per Table 1-2.
During the selection process, the user should take into consideration the
following when determining the appropriate thermal stress test method:
* Wave solder, selective solder, hand solder assembly processes (see
3.6.1.1)
* Conventional (eutectic) reflow processes (see 3.6.1.2)
* Lead-free reflow processes (see 3.6.1.3)
Table 1-2 Default Requirements
Category
Default Selection
Performance Class
Class 2
Material
Epoxy-Glass Laminate
Final Finish
Finish X
Minimum Starting Foil
1/2 oz. for all internal and external layers except Type 1 which shall
start with 1 oz.
Copper Foil Type
Electrodeposited
Hole Diameter Tolerance
Plated, components
Plated, via only
Non-plated
(±) 100 µm [3,937 µin]
(+) 80 µm [3,150 µin], (-) no requirement, (may be totally or partially
plugged)
(±) 80 µm [3,150 µin]
Conductor Width tolerance
Class 2 requirements per 3.5.1
Conductor Spacing tolerance
Class 2 requirements per 3.5.2
Dielectric Separation
90 µm [3,543 µin] minimum
Lateral Conductor Spacing
100 µm [3,937 µin] minimum
Marking Ink
Contrasting color, nonconductive
Solder Mask
Not applied, if not specified
Solder Mask, specified
Class T of IPC-SM-840 if class not specified
Solder Coating
Sn63/Pb37
Solderability Test
Category 2 of J-STD-003
Thermal Stress Test
IPC-TM-650, Method 2.6.8, Condition A
Test Voltage, Isolation Resistance
40 Volts
Qualification not specified
See IPC-6011
3.6.1 Thermal Stress Testing Test coupons or production PBs shall be
thermally stressed. Per the applicable criteria listed in 1.3.3, one or
more of the following Test Methods shall be required.
3.6.1.1 Thermal Stress Testing, Method 2.6.8 Test coupons or production
PBs shall be thermally stressed in accordance with IPC-TM-650, Method
2.6.8, Test condition A.
3.6.1.2 Thermal Stress Testing, Method 2.6.27 (230 °C)Test coupons or
production PBs shall be thermally stressed in accordance with IPC-TM-650,
Method 2.6.27, 230° C Reflow Profile.
3.6.1.3 Thermal Stress Testing, Method 2.6.27 (260 °C)Test coupons or
production PBs shall be thermally stressed in accordance with IPC-TM-650,
Method 2.6.27, 260° C Reflow profile.
3.6.1.4 Deviations to Thermal Stress Testing Deviations to these
requirements shall be AABUS.
Now you are at the Test Method. We have not changed the old one or its
requirement for use. The default in the new one is 6 X 260°C, the last
time I looked.
Dewey
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Wendi Boger
Sent: Thursday, April 30, 2009 7:02 AM
To: [log in to unmask]
Subject: [IPC-600-6012] Reflow testing
Everyone,
I have a quick question. When reviewing my notes from the meeting
I noted that the new reflow thermal stress frequency would be 1X reflow
= 1X solder float. I have a final draft of the 2.6.27 test method and
it shows 6x reflow cycles. Are we equating 1X solder float to 6X
reflow?
Is the test method released yet?
Wendi Boger
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