We had better not.
Werner
-----Original Message-----
From: Wendi Boger <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, 30 Apr 2009 10:01 am
Subject: [IPC-600-6012] Reflow testing
Everyone,
I have a quick question. When reviewing my notes from the meeting
I noted that the new reflow thermal stress frequency would be 1X reflow
= 1X solder float. I have a final draft of the 2.6.27 test method and
it shows 6x reflow cycles. Are we equating 1X solder float to 6X
reflow?
Is the test method released yet?
Wendi Boger