IPC-600-6012 Archives

April 2009

IPC-600-6012@IPC.ORG
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Subject:
Reflow testing
From:
Wendi Boger <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Thu, 30 Apr 2009 10:01:38 -0400
Content-Type:
text/plain
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Everyone,

 

     I have a quick question.  When reviewing my notes from the meeting
I noted that the new reflow thermal stress frequency would be 1X reflow
= 1X solder float.  I have a final draft of the 2.6.27 test method and
it shows 6x reflow cycles.  Are we equating 1X solder float to 6X
reflow?  

 

     Is the test method released yet?

 

 

Wendi Boger

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