Thanks all for your informative inputs. Steve's photos do look like what
I would expect.
Best Regards,
-Joe
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From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, March 02, 2009 6:46 AM
To: [log in to unmask]
Subject: Re: [TN] Reflowing CBGA component (with high Sn balls) using
Eutectic solder paste
That is exactly what they should look like. The demarcation line Steve
refers to is the change in color from the bright/shiny melted solder to
the darker, more grainy lead ball, with a smooth transition, ie, no
evidence of non-wetting along the line of demarcation.
Steve, looks like you have this process nailed down pretty good.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Friday, February 27, 2009 12:28 PM
To: [log in to unmask]
Subject: Re: [TN] Reflowing CBGA component (with high Sn balls) using
Eutectic solder paste
Hi All!
Dave is right, the balls are Pb90Sn10 according to IBM's package
description in this document:
http://tinyurl.com/da4cot
We build a lot of boards that use this device, and the joints do look a
lot different than other BGA's that have eutectic balls. There will be a
very noticable demarcation line between the solderjoint and ball itself.
Here's what our joints look like:
http://stevezeva.homestead.com/files/PowerPC_Joints.jpg
The board isn't ENIG like Joe's, it's HASL. My peak temperatures range
from 218 C. to 226 C., and my TAL ranges from 75-seconds to 81-seconds
depending on which thermocouple you're looking at in my temperature
plot.
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Friday, February 27, 2009 10:44 AM
To: [log in to unmask]
Subject: Re: [TN] Reflowing CBGA component (with high Sn balls) using
Eutectic solder paste
Hi Joe - could you please check your solder alloy element ratio, did you
really mean Pb90Sn10? The Sn90Pb10 begins melting at 183C and the
Pb90Sn10 begins melting at 268C. I am not familiar with CBGA using a
Sn90Pb10 ratio.
Dave Hillman
Rockwell Collins
[log in to unmask]
Joe Macko <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
02/27/2009 10:03 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
[log in to unmask]
To
[log in to unmask]
cc
Subject
[TN] Reflowing CBGA component (with high Sn balls) using Eutectic solder
paste
Hi All,
My question is related to the soldering of IBM PPC CBGAs type components
(that have Sn90Pb10 solder balls) using Sn63 paste onto ENIG finished
boards. What are the "determining-factors" to improve the
wetting/diffusion of the eutectic solder paste into the high Sn solder
balls. The eutectic solder appears to wet well to the ENIG pads located
on the board but occasionally I see eutectic solder fillets that do not
always appear to fuse well with the high Sn content balls (if fuse is
the correct word?). thx
Best Regards,
-Joe
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