Dave

How did you verify the metal to be gold?

Best regards
Lee
JLP Consultants LLC
804 779 3389
  ----- Original Message ----- 
  From: Dave Connitt<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Thursday, March 05, 2009 3:09 PM
  Subject: [TN] ENIG Question


  Hello All,
  I have a question regarding a strange situation regarding reflow
  soldering ENIG finish boards.
  We have seen a few boards that have what seems to be gold "washing "
  down between pads and creating shorts. This seems to come and go. This
  is a flex circuit that is placed on a pallet to go through our SMT line.
  One other bothersome issue is that we are having difficulty getting
  proper solder stencil alignment across all the flexes in the pallet. I
  am pushing to have the flex "panelized" from the vendor to increase
  positional accuracy but the jury is still out on that.
  I suspect these two issues are related. If the solder gets deposited
  "off pad"slightly could the washing process be moving some of the gold
  in between pads? I attached an example.
  Has anybody come across this?
  If so, what was the solution?
   
  Thanks,
  Dave Connitt CID+

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