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Subject:	Re: ENIG Question
From:	Vladimir Igoshev <[log in to unmask]>
Reply To:	[log in to unmask]
Date:	Thu, 5 Mar 2009 21:42:27 +0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

Hi Dave,



Isn't it so-called "Nickel foot" you see on your boards?



Can you ask Steve to post pictures?



Regards,



Vladimir

------Original Message------

From: Dave Connitt

Sender: TechNet

To: [log in to unmask]

ReplyTo: TechNet E-Mail Forum

ReplyTo: [log in to unmask]

Sent: Mar 5, 2009 15:09

Subject: [TN] ENIG Question



Hello All,

I have a question regarding a strange situation regarding reflow

soldering ENIG finish boards.

We have seen a few boards that have what seems to be gold "washing "

down between pads and creating shorts. This seems to come and go. This

is a flex circuit that is placed on a pallet to go through our SMT line.

One other bothersome issue is that we are having difficulty getting

proper solder stencil alignment across all the flexes in the pallet. I

am pushing to have the flex "panelized" from the vendor to increase

positional accuracy but the jury is still out on that.

I suspect these two issues are related. If the solder gets deposited

"off pad"slightly could the washing process be moving some of the gold

in between pads? I attached an example.

Has anybody come across this?

If so, what was the solution?

 

Thanks,

Dave Connitt CID+



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