Hi Dave,

In my experience a flex being panelized is still not very accurate flex
to flex.  We obtained slightly better results from a 3 up pallet than a
3 up panel.

I have never done an ENIG flex so I can't help there.

Jerry Dengler
Production Manager
Pergamon Corporation
PH:  610-239-0721
Fax: 610-239-0720


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Connitt
Sent: Thursday, March 05, 2009 3:09 PM
To: [log in to unmask]
Subject: [TN] ENIG Question

Hello All,
I have a question regarding a strange situation regarding reflow
soldering ENIG finish boards.
We have seen a few boards that have what seems to be gold "washing "
down between pads and creating shorts. This seems to come and go. This
is a flex circuit that is placed on a pallet to go through our SMT line.
One other bothersome issue is that we are having difficulty getting
proper solder stencil alignment across all the flexes in the pallet. I
am pushing to have the flex "panelized" from the vendor to increase
positional accuracy but the jury is still out on that.
I suspect these two issues are related. If the solder gets deposited
"off pad"slightly could the washing process be moving some of the gold
in between pads? I attached an example.
Has anybody come across this?
If so, what was the solution?
 
Thanks,
Dave Connitt CID+

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