Good morning all. Thanks for catching that Dave. Yes, the correct ratio
is as you stated, Sn10Pb90. 

 

Best Regards,

-Joe

 

From: [log in to unmask] [mailto:[log in to unmask]]

Sent: Friday, February 27, 2009 8:44 AM
To: TechNet E-Mail Forum; Macko, Joe @ IEC
Cc: [log in to unmask]
Subject: Re: [TN] Reflowing CBGA component (with high Sn balls) using
Eutectic solder paste

 


Hi Joe - could you please check your solder alloy element ratio, did you
really mean Pb90Sn10? The Sn90Pb10 begins melting at 183C and the
Pb90Sn10 begins melting at 268C. I am not familiar with CBGA using a
Sn90Pb10 ratio. 

Dave Hillman 
Rockwell Collins 
[log in to unmask] 



Joe Macko <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]> 

02/27/2009 10:03 AM 

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Subject

[TN] Reflowing CBGA component (with high Sn balls) using Eutectic solder
paste

 

		




Hi All,



My question is related to the soldering of IBM PPC CBGAs type components
(that have Sn90Pb10 solder balls) using Sn63 paste onto ENIG finished
boards.  What are the "determining-factors" to improve the
wetting/diffusion of the eutectic solder paste into the high Sn solder
balls. The eutectic solder appears to wet well to the ENIG pads located
on the board but occasionally I see eutectic solder fillets that do not
always appear to fuse well with the high Sn content balls (if fuse is
the correct word?).  thx





Best Regards,

-Joe




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