Hi Joe,
That is great information! Thank you very much!
Regards
Geok Ang
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, 26 March 2009 11:47 PM
To: Tan Geok Ang; TechNet E-Mail Forum
Subject: RE: [TN] LGA acceptance
Hi Geok.
I checked further and found another thread in my archived files that I
should have mentioned earlier that further discusses LNA installation,
AN116. AN116 is actually a video that is very informative. All of LT's
reliability testing was done with a maximum void percentage of 30% so
they recommend that the void area be less than 30%. Since IPC-A-610 is
silent on this, I have been using <30%, which we are typically well
below.
Best Regards,
-Joe
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From: Tan Geok Ang [mailto:[log in to unmask]]
Sent: Monday, March 23, 2009 6:02 PM
To: Macko, Joe @ IEC; TechNet E-Mail Forum
Subject: RE: [TN] LGA acceptance
Hi Joe,
Thank you. I did come across this guide and even have one of
their pictures which showed void (not X-ray) but they do not indicate
what the acceptance percentage of the void is.
We are able to achieve less than 25% of void while one of ours
overseas supplier claims that there is not guideline from IPC 610 which
we stated as the reference to follow during the procurement.
Regards
Geok Ang
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, 24 March 2009 12:02 AM
To: TechNet E-Mail Forum; Tan Geok Ang
Subject: RE: [TN] LGA acceptance
Good morning Tan,
I ran into the same problem a while back but found an excellent source
of process info on the component manufacturer's website. Check out
Linear Technology's Application Note 100, "Recommended Land Pattern
Design, Assembly and Rework Guidelines For DC/DC uModule in LNA Package"
document. It is the best source of LNA type process and accept-reject
info that I have found readily available. Sorry but I do not have a link
to their website. Good luck
Best Regards,
-Joe
"This e-mail and any attachments are solely for the use of the addressee
and may contain L-3 proprietary information that may also be defined as
U.S. Government export controlled technical data. If you are an
unintended recipient of this e-mail, use, disclosure or distribution of
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From: TechNet [mailto:[log in to unmask]] On Behalf Of Tan Geok Ang
Sent: Friday, March 20, 2009 4:00 AM
To: [log in to unmask]
Subject: [TN] LGA acceptance
Hi All, base on IPC-A-610D, there is no explicit requirement for LGA,
all it says about Surface Mount Area Array is "for devices with solder
balls that collapse during reflow". Is there any IPC
standard/specification define the void on LGA? Thank you all and have a
nice day!
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