Agreed!

In  my experience, the lead free devices we supply to our customers are 
expected to produce good solder joints and survive at peak soldering 
temperatures between 230 and 260 deg C. Further, 250 deg C seems pretty 
much a typical soldering temperature  judging from temperature profiles 
I've seen from a variety of different assembly houses in Europe and the 
far east.

Regards,



Guy Ramsey wrote:
> Pretty standard stuff Doug. 
> SnPb below 220°C and PbFree above 240°
> 250° is definitely not low temp.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Erb
> Sent: Monday, March 23, 2009 11:59 AM
> To: [log in to unmask]
> Subject: [TN] Low temp RoHS solder paste
>
> In Asia, many CEMs are successfully applying components using RoHS
> compliant solder pastes at 250C max temps in their ovens; so I've been
> told by my colleagues in Japan.  They do not have sourcing info on the
> paste suppliers, however.  Is anyone out there familiar with the
> practice and if, indeed, there are new solder alloys that are capable of
> achieving Class 3 wetting integrity at 250C?
>
>  
>
> Doug Erb,
>
> Senior FAE
>
> Hirose Electric USA
>
> Industrial Segment
>
> Office direct: (949) 218-3445
>
> Fax direct: (949) 218-3425
>
> Mobile: (949) 463-8447
>
> Main office: (805) 522-7958
>
>  
>
>  
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>
>   

-- 
Eric Christison Msc
Mechanical Engineer
Consumer & Micro group
Imaging Division

STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom

Tel:	+44 (0)131 336 6165
Fax:	+ 44 (0)131 336 6001

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------