IPC 7093 - Design and Assembly Process Implementation for Leadless Surface
Mount Components has just started - I think there was one meeting. Meeting
notes and draft can be found on IPC Web site
Regards
Paul Lotosky
Global Director, Customer Technical Support
Cookson Electronics
109 Corporate Blvd
South Plainfield, NJ 07008
Cell 201-914-3242
Tan Geok Ang <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/20/2009 06:06 AM
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[TN] LGA acceptance
Hi All, base on IPC-A-610D, there is no explicit requirement for LGA, all
it says about Surface Mount Area Array is "for devices with solder balls
that collapse during reflow". Is there any IPC standard/specification
define the void on LGA? Thank you all and have a nice day!
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