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March 2009

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Subject:
Re: LGA acceptance
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Fri, 20 Mar 2009 23:23:08 +0800
Content-Type:
text/plain
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text/plain (61 lines) 
Hi Leif, I don't think to it is suitable as LGA (mainly square pads) is similar to BGA (round pads) without solder balls/bumps. 

________________________________

From: TechNet on behalf of Leif Erik Laerum
Sent: Fri 3/20/2009 8:33 PM
To: [log in to unmask]
Subject: Re: [TN] LGA acceptance



Tan,

I beleive this is covered by section 8.2.13 (PQFN).

Leif Erik Laerum
Quality Assurance Manager
Texas Memory Systems
[log in to unmask]
Tel: (713) 266-3200 x468
www.texmemsys.com



Tan Geok Ang wrote:
> Hi All, base on IPC-A-610D, there is no explicit requirement for LGA, all it says about Surface Mount Area Array is "for devices with solder balls that collapse during reflow". Is there any IPC standard/specification define the void on LGA? Thank you all and have a nice day!
> 
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