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March 2009

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Subject:
From:
Leif Erik Laerum <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leif Erik Laerum <[log in to unmask]>
Date:
Fri, 20 Mar 2009 07:33:24 -0500
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Tan,

I beleive this is covered by section 8.2.13 (PQFN).

Leif Erik Laerum
Quality Assurance Manager
Texas Memory Systems
[log in to unmask]
Tel: (713) 266-3200 x468
www.texmemsys.com



Tan Geok Ang wrote:
> Hi All, base on IPC-A-610D, there is no explicit requirement for LGA, all it says about Surface Mount Area Array is "for devices with solder balls that collapse during reflow". Is there any IPC standard/specification define the void on LGA? Thank you all and have a nice day!
>  
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