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March 2009

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Subject:
LGA acceptance
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Fri, 20 Mar 2009 19:00:20 +0800
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Hi All, base on IPC-A-610D, there is no explicit requirement for LGA, all it says about Surface Mount Area Array is "for devices with solder balls that collapse during reflow". Is there any IPC standard/specification define the void on LGA? Thank you all and have a nice day!
 

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