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March 2009

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Subject:
From:
Pete Houwen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Pete Houwen <[log in to unmask]>
Date:
Thu, 19 Mar 2009 09:50:13 -0500
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All of those caveats are certainly true.  But design is all about the tradeoffs.  
To make a blanket rule that no copper of any kind, vias, traces, planes, be 
allowed under any part on any board removes all of the variables that would 
normally go into this kind of decision.  What if these are not high speed 
designs?  What costs more, a rare short from missing soldermask, or two more 
layers on every board?

Never say never.

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