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March 2009

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Subject:
From:
Chris Mahanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chris Mahanna <[log in to unmask]>
Date:
Wed, 18 Mar 2009 21:31:03 -0400
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Amol,

Pitfall- don't assume that every implementation of underfill increases reliability.
Inspection-  In certain circumstances I believe that you will find CSAM less than adequate.  We suggest a combination of acoustics and a special sectioning/imaging technique that we use.
Don't forget about SIR and ECM.  If you make 'em mechanically sound, sometimes those pesky ionics will sneak up the failure hierarchy.

Chris


Chris Mahanna
Robisan Laboratory Inc.
6502 E. 21st Street
Indianapolis, Indiana 46219
317-353-6249


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Wednesday, March 18, 2009 3:48 PM
To: [log in to unmask]
Subject: [TN] Underfill Application

Dear Technetters,
We are about the develop a process for underfilling BGAs for a high reliability application. the underfill will be a rework able underfill. I wanted to poll the technet on:
1.      Guidance on material selection
2.      most common materials being used out there and the process equipment being used to do so.
3.      Common pitfalls and things to lookout for
4.      inspection techniques used to inspect the finished product
5.      a good source for info on underfilling (books, papers etc.,)

Thanks in advance.

Regards,
Amol





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