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Subject:	Re: Traces and vias under components
From:	"Upton, Shawn" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Upton, Shawn
Date:	Wed, 18 Mar 2009 11:59:16 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

Rework issues?  Hard to cut a trace under a component.  Also, are they
using tented vias?  Untented via's are easy to probe, while tented ones
are bit harder.

Shawn Upton, KB1CKT
Test Engineer
Allegro MicroSystems, Inc
[log in to unmask]
603.626.2429/fax: 603.641.5336

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Wednesday, March 18, 2009 11:54 AM
To: [log in to unmask]
Subject: Re: [TN] Traces and vias under components

If it's a space issue, that's your argument.....if not, why argue?
Customer is always right........


-----Original Message-----
From: wheels [mailto:[log in to unmask]]
Sent: Wednesday, March 18, 2009 11:01 AM
To: [log in to unmask]
Subject: [TN] Traces and vias under components

Guys,

We have a customer which we are designing a mostly SMT board for that
requires all traces and vias not to be under components. This would also
include any planes being under the components. I guess in the past they
had a board designed by some else that had a shorting problem with
traced and vias under the components. They are insistence that this is
the way it has to be. Has anyone else had experience with this sort of
demands? This is not for space, military, high voltage, high vibration
or a medical application.
Can anyone think of anything we could tell they to change their mind?

Thank you,
wheels

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