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March 2009

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Mon, 16 Mar 2009 16:21:56 -0400
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Dear colleagues,
 
Is there any IPC or other standard talking about the good design practices that ensure PCB flatness?
 
Does any standard explain how to balance Cu, for instance? Or how to choose laminate or design the stackup?
 
Thanks,
 
Ioan Tempea, ing.
Ingénieur Principal Fabrication / Sr. Manufacturing Engineer 
 
30 ans déjà! - Already 30 years!
950 rue Bergar, Laval, Québec, H7L 5A1
t : 450-967-7100 ext : 244
Mtl : 514-990-5762
f : 450-967-7444
[log in to unmask]
www.digico.cc <http://www.digico.cc/> 
P N'imprimer que si nécessaire - Print only if you must
 

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