Totally agree; they have to be clean, and dry.
I don't want to get into all of the arguments about RMA versus WS, but
it has been my experience that the WS process is much less likely to
cause any issues with flux residues, whether from a high-impedance/high
frequency standpoint or from a reliability standpoint. I have had 30
years of experience using RMA on torpedoes, ammunitions, aviation
guidance systems, hardened computers, cruise missiles, medical,
industrial, etc. and about 20 years of experince using WS on the same. I
regularly perform consulting engineering work for other companies on
cleaning and soldering issues, and nearly 100% of the issues I have had
to deal with regarding cleanliness has been with RMA and no-clean flux
residues, very rarely water soluble.
If you use WS, you need a really good wash process, and you need to
perform your process control checks (Ionograph, Omegameter) and DfM to
make sure there are no entrapment issues designed in, but if you have
those checks in place, you are far less likely to have any issues with
WS flux residues than you will with RMA and NC.
-----Original Message-----
From: Wilson, Bob [mailto:[log in to unmask]]
Sent: Thursday, March 12, 2009 2:15 PM
To: Stadem, Richard D.; TechNet E-Mail Forum
Subject: RE: [TN] ROL1 RUMOR
Agreed.
I took a class at UCLA with Bob Hanson. He stated that Hi-Rel boards
need to be clean but the best way is to use RMA, then next-best is WSP
(Water Soluble Paste) then last is NC (No Clean).
But they do have to be clean.
If the Hi-Rel boards aren't clean, then they cause inductive crosstalk.
Bob Wilson
-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Thursday, March 12, 2009 12:00 PM
To: TechNet E-Mail Forum; Wilson, Bob
Subject: RE: [TN] ROL1 RUMOR
No it isn't. High speed stuff needs to be clean of any residues.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wilson, Bob
Sent: Thursday, March 12, 2009 1:02 PM
To: [log in to unmask]
Subject: Re: [TN] ROL1 RUMOR
But...but...RMA is required on high-speed stuff!
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Thursday, March 12, 2009 11:00 AM
To: [log in to unmask]
Subject: Re: [TN] ROL1 RUMOR
I heard from both our Kester and Alpha reps that there was a consensus
to drop RMA flux materials due to the fact that so few companies use
this formulation anymore. The ROL0 and ROL1 fluxes are more difficult to
clean, solvents are required and are expensive, water soluble fluxes are
much easier to completely remove, and at the same time all of the
commercial side of the industry has typically gone to no-clean flux
formulations. So some of the solder paste, flux, and wire vendors are
taking a long hard look at continuing to make these products to a
dwindling customer base.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee Whiteman
Sent: Thursday, March 12, 2009 12:31 PM
To: [log in to unmask]
Subject: [TN] ROL1 RUMOR
Heard a rumor from one of my colleagues that ROL1 solder flux would no
longer be manufactured.
I find this extremely hard to believe. Has anyone heard this rumor?
Just curious.
Thanks.
Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]
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