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March 2009

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Subject:
From:
Ted Tontis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ted Tontis <[log in to unmask]>
Date:
Wed, 11 Mar 2009 08:37:56 -0500
Content-Type:
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I can not tell you how high you can go but I can tell you that we are
successfully soldering a TH header with components as high as 10mm from the
board surface, on the solder side. We had to bottom out our solder pot and
crank up the solder so she looks like old faithful. The only down side, that
I have noticed, is there is a lot of dross from the process. I remember the
first time we sent it over the wave I thought the solder was going to spill
over the front side of the pot. As luck would have it just barely stays in. 

Ted T. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Tuesday, March 10, 2009 1:46 PM
To: [log in to unmask]
Subject: [TN] Max height of components acceptable for wave pallets

Dear Technos,
 
What is the maximum height of the components on the solder side that will
allow for using wave soldering masking fixtures?
 
Thank you,
 
Ioan Tempea, ing.
Ingénieur Principal Fabrication / Sr. Manufacturing Engineer 
 
30 ans déjà! - Already 30 years!
950 rue Bergar, Laval, Québec, H7L 5A1
t : 450-967-7100 ext : 244
Mtl : 514-990-5762
f : 450-967-7444
[log in to unmask]
www.digico.cc <http://www.digico.cc/> 
P N'imprimer que si nécessaire - Print only if you must
 

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