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March 2009

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Tue, 10 Mar 2009 11:35:17 -0700
Content-Type:
text/plain
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text/plain (125 lines)
I thought I was the one known for patent replies.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Tuesday, March 10, 2009 8:12 AM
To: [log in to unmask]
Subject: Re: [TN] ACF Inforamation

You are going to need a thermode bonder able to produce fairly
significant
pressure (depends on the film). I recommend ceramic thermode heads for
co
planarity and a floating head design.

Be sure not to over compress the film as the resistance generally goes
up!

You might find reading my patent of some use, it can be found here on
the
USPTO web site:

http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=
%2Fn
etahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=saturn.A
SNM.
&s2=burke.INNM.&OS=AN/saturn+AND+IN/burke&RS=AN/saturn+AND+IN/burke

Patent number is 6,776,859

John Burke
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of weiner, mickey
Sent: Monday, March 09, 2009 11:28 PM
To: [log in to unmask]
Subject: [TN] ACF Inforamation

Hi 
I am looking for information on ACF.
Process, tools and materials,
Standards - if exist and  practices
Design rules
Quality issues 
The application is to bond  flex  with 34 contacts of  3 mil traces 4
mils space  on to a rigid. 
I'll appreciate any experience notes and suggestions since this is still
on the drawing board.
Thanks
 
Best Regards
Mickey Weiner
 

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