We follow HDB-217 and 883 and 1553 stds in essential. One NASA example:

http://www.moasoftware.co.kr/board2/data/design/dfr07.pdf

Another typical example is this good one from EXIDA:

http://www.prelectronics.com/filer/9202_FMEDA.pdf

However, the handbook refer to one decade or more old statistics, so for 
many new components derating and failure rate figures etc are not available. 
You have to make your own FMEA, Arrhenius nomograms and all that stuff.

I'm not an expert but have been involved frequently in the field. We had 
several people with a PhD degree working with Failure Data Analysis, but 
nowadays only one guy is left. The reason is that the reliability of many 
processes has been improved a lot. One or two decades ago, we had boxes with 
hundreds of components waiting for registering and analysis. Today nearly 
nothing. If there are any issues, we are causing them ourselves in the 
manufacturing process. And even these are few nowadays. Those of you who 
have been involved, remember all the problems with tantalum caps? Or CMOS? 
Or humidity in DIPs? Ahora nada de estos.

Best you can do to get answer on your questions is to call someone at NASA 
(e.g. Mr Brusse, who use to read TN mails). Or ESTEC. Or Vernier Anglemajor.

Inge


----- Original Message ----- 
From: "Kane, Amol (349)" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, March 06, 2009 3:48 PM
Subject: [TN] Failure Data Analysis Techniques


Dear Technetters,
I am doing some research (for my PhD dissertation) on the common Failure 
Data Analysis Techniques (or software) people are using in the industry to 
analyze their failure data. Specifically, end of line SMT defects across all 
assemblies and product lines. I realize that failure data is something that 
all companies will not discuss. I am not looking for results, just methods 
that you might be using to arrive at informed conclusions. Any responses 
(offline or on the forum) will be greatly appreciated

Regards,
Amol



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