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Date: | Fri, 20 Mar 2009 23:23:08 +0800 |
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Hi Leif, I don't think to it is suitable as LGA (mainly square pads) is similar to BGA (round pads) without solder balls/bumps.
________________________________
From: TechNet on behalf of Leif Erik Laerum
Sent: Fri 3/20/2009 8:33 PM
To: [log in to unmask]
Subject: Re: [TN] LGA acceptance
Tan,
I beleive this is covered by section 8.2.13 (PQFN).
Leif Erik Laerum
Quality Assurance Manager
Texas Memory Systems
[log in to unmask]
Tel: (713) 266-3200 x468
www.texmemsys.com
Tan Geok Ang wrote:
> Hi All, base on IPC-A-610D, there is no explicit requirement for LGA, all it says about Surface Mount Area Array is "for devices with solder balls that collapse during reflow". Is there any IPC standard/specification define the void on LGA? Thank you all and have a nice day!
>
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