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Date: | Tue, 24 Mar 2009 09:22:13 -0400 |
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Is that 250 the oven set point of the measured PCB Temp?
To get a good "Spike" in the reflow profile you need a fairly hot oven. If
you set the oven anywhere near 250 you get a slow ramp to 250 which burns
off the flux.
I have played with SnPb and just a little with SAC. But I recall 260 or 270
as the oven set point in the "Spike" zone. And this is a real pin for the
fluxes which burn off quickly on hot areas.
I never liked the SAC and hot air reflow, the process window was much
smaller than SnPb. A vapor phase reflow gives you a really tight control
over temp, much more than hot air. But vapor phase is more expensive.
Bob Kondner
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Tuesday, March 24, 2009 9:08 AM
To: [log in to unmask]
Subject: Re: [TN] Low temp RoHS solder paste
Pretty standard stuff Doug.
SnPb below 220°C and PbFree above 240°
250° is definitely not low temp.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Erb
Sent: Monday, March 23, 2009 11:59 AM
To: [log in to unmask]
Subject: [TN] Low temp RoHS solder paste
In Asia, many CEMs are successfully applying components using RoHS
compliant solder pastes at 250C max temps in their ovens; so I've been
told by my colleagues in Japan. They do not have sourcing info on the
paste suppliers, however. Is anyone out there familiar with the
practice and if, indeed, there are new solder alloys that are capable of
achieving Class 3 wetting integrity at 250C?
Doug Erb,
Senior FAE
Hirose Electric USA
Industrial Segment
Office direct: (949) 218-3445
Fax direct: (949) 218-3425
Mobile: (949) 463-8447
Main office: (805) 522-7958
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