You should find most of the data you need in the manufacturer's data
sheet. Steven has listed all the ones I can think of.
We found paste to be more economic to use than film. It will depend upon
how much automation you can afford to put in.
Carry out a proper DOE to establish your process window.
The track and gap you specify looks challenging to me. Not only will you
find you are nearing the limit of the ACF but you will need to be very
precise in the positioning of the flex onto the substrate. A bigger
track and gap would allow you to put alignment holes into both the
substrate and the flex allowing the parts to be aligned by pins on the
curing fixture.
Good luck.
Steven Creswick wrote:
> Mickey,
>
> There are a number of large suppliers out there. If you do a web search for
> Anisotropic Conductive Film you should find a number of them in the China,
> Korea, Singapore area as well.
>
> Here are just a few
>
> Steve
>
> http://solutions.3m.com/wps/portal/3M/en_WW/electronics/home/productsandserv
> ices/products/TapesAdhesives/AnisotropicConductiveFilm/
>
> http://www.sonycid.jp/en/products/dd1/
>
> http://www.acffilm.com/
>
> http://www.hitachi-chem.co.jp/english/ir/pp_acf.html
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of weiner, mickey
> Sent: Tuesday, March 10, 2009 2:28 AM
> To: [log in to unmask]
> Subject: [TN] ACF Inforamation
>
> Hi
> I am looking for information on ACF.
> Process, tools and materials,
> Standards - if exist and practices
> Design rules
> Quality issues
> The application is to bond flex with 34 contacts of 3 mil traces 4
> mils space on to a rigid.
> I'll appreciate any experience notes and suggestions since this is still
> on the drawing board.
> Thanks
>
> Best Regards
> Mickey Weiner
>
>
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--
Eric Christison Msc
Mechanical Engineer
Consumer & Micro group
Imaging Division
STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom
Tel: +44 (0)131 336 6165
Fax: + 44 (0)131 336 6001
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