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February 2009

TGAsia@IPC.ORG

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From:
"Qiu, Baoping (GE Infra, Transportation)" <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Qiu, Baoping (GE Infra, Transportation)
Date:
Fri, 13 Feb 2009 13:02:35 +0530
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This is Kelvin Qiu from GE transportation systems.
the original point of connector in PCB layout library(symbol/cell),normally we define as the center point of the connector in GE company...but somebody told me it is defined as pin1 of connector from IPC criteria, anybody can told me which IPC standard I can refer to?
Thanks/Kelvin

-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Leesha Peng
Sent: Friday, February 13, 2009 2:46 PM
To: [log in to unmask]
Subject: [TGAsia] 答复: JEDEC standard for chamfer/Depanel

Hi LP,

IPC has spec for depanalization in documents IPC 7351 and IPC 2222.

Best Regards
Leesha Peng 彭丽霞
General Manager 总经理
IPC China
上海市长宁区延安西路1088号2303室
Suite 2303,#1088 West Yan'an Rd., Changning, Shanghai 200052 PRC
Tel: +86 21 54973435
Fax:+86 21 54973437
MP: +86 139 0299 4705
[log in to unmask]<mailto:[log in to unmask]>
www.ipc.org.cn<http://www.ipc.org.cn>
________________________________
发件人: TGAsia [[log in to unmask]] 代表 LP Koay [[log in to unmask]]
发送时间: 2009年2月11日 20:55
收件人: [log in to unmask]
主题: [TGAsia] JEDEC standard for chamfer/Depanel

Hi,

If any of you know any of document in JEDEC is mentioned about the max condition (in x-direction) for chamfer or depanel process?

Thanks in Advance!!

Regards,
LP

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