Hi Wayne
Well, I've been pointed to J-STD-002 for solderability testing and steam
"conditioning"... Which specifies rosin flux - if they aren't using
that I will have concerns.
One thing I've seen though, on these parts and a couple of others in the
past, is that a dip test can be misleading. I can dip a part and have
it look great, but as soon as you touch the lead with a soldering iron -
whoosh, there goes the solder. We have seen this on marginal parts,
these included.
regards,
- Graham
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne
Sent: Friday, February 06, 2009 11:01 AM
To: [log in to unmask]
Subject: Re: [TN] Part solderability
Hi Graham!
We had big wetting problems with a tantalum cap last year and got a
similar run-around, but the manufacturer did eventually admit to a
plating problem and sent us documentation that they had since taken
corrective action. But I suspect there were many other complaints and I
suspect they didn't issue a general recall for their production lot.
Possibly they could wet to the parts a little better than we could
because, like you, we are using RMA and they are evaluating the
wettability with a more active aqueous based process, like the majority
of CM's use.
Wayne Thayer
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: Friday, February 06, 2009 9:18 AM
To: [log in to unmask]
Subject: Re: [TN] Part solderability
Pin grid array parts, and they claim no change to their process... -
we both didn't change anything :-)
regards,
- Graham
-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: Friday, February 06, 2009 10:17 AM
To: TechNet E-Mail Forum; Collins, Graham (FN) @ ESI
Subject: RE: [TN] Part solderability
Hi Graham!
What kind of parts are these? Have they changed the plating recently on
them?
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Collins
Sent: Friday, February 06, 2009 8:12 AM
To: [log in to unmask]
Subject: [TN] Part solderability
Hi guys.
A while back I rejected a bunch of parts due to non wetting when we went
to solder them.
The manufacturer has come back with a response to our guys, saying that
they did a steam aging test on them and they passed fine. He wants to
discuss it with us.
Obviously this is not good - they pass his test but I can't solder the
things. Which makes me suspect his test... but makes him suspect my
process. I don't know enough about steam aging tests to discuss this
well. Obviously I need to ask what kind of flux he is using, but
anything else?
Our process is SnPb, we use RMA flux, and the wave soldering machine
runs at 500F for the pot. This is on an assembly that we have happily
built for about 7 years, with the same manufacturer of part, and no
process changes that I can identify as significant. The part is what I
would call marginally solderable, if we hand solder it and put a fair
bit of heat to the lead we can get it to solder, but not well or easily.
No previous soldering issues with the part.
regards,
Graham Collins
Halifax Production Engineering
L-3 communications Electronic Systems
(902) 873-2000 ext. 6215
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