Dave
I hadn't realised that Colin Thwaites had published such a paper. I
believe that his research of the subject may have been instigated by
myself, following publication of the paper I presented at Inter/Nepcon
'69, in Brighton, England, 'New Aspects on the Solderability of Printed
Circuits'. Unfortunately, I no longer have a copy of the Technical
Proceedings but, as I remember it (40 years is a long time ago!!!), I
evoked the problems caused by both pumice and ScotchBrite cleaning,
whereby the abrasive particles were embedded into the copper pore
structure and then the copper was swaged over them. The only way they
could be released was with a light persulfate etch and forceful rinse,
without which dewetting was inevitable after abrasive cleaning.
Having written this, I then re-read what I wrote in Section 7.2.4 (p.
76) of my book and found that it's similar in essence but more complete,
so my aged memory can't be that bad! Whatever, abrasives and
solderability make poor bedmates!
Hope this helps.
Brian
David D. Hillman wrote:
> Hi gang! Ok, I am in search of a technical reference and my usual, "always
> works" sources have failed me. I am looking for the following technical
> reference:
>
> Thwaites, C. J. and Mackay, C. A. , " Some Effects of Abrasive Cleaning on
> the Solderability of Printed Circuits", Metal Finishing Journal, Sept.
> 1968, pp. 291-294, (also may be listed as ITRI Publication 386)
>
>
> Anyone have a copy or can direct me to where a copy can be obtained? And
> yes, I have sent a request to the ITRI folks already (International Tin
> Research Institute)
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
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