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February 2009

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 27 Feb 2009 10:43:43 -0600
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Hi Joe - could you please check your solder alloy element ratio, did you 
really mean Pb90Sn10? The Sn90Pb10 begins melting at 183C and the Pb90Sn10 
begins melting at 268C. I am not familiar with CBGA using a Sn90Pb10 
ratio.

Dave Hillman
Rockwell Collins
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Joe Macko <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
02/27/2009 10:03 AM
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Subject
[TN] Reflowing CBGA component (with high Sn balls) using Eutectic solder 
paste






Hi All,

 

My question is related to the soldering of IBM PPC CBGAs type components
(that have Sn90Pb10 solder balls) using Sn63 paste onto ENIG finished
boards.  What are the "determining-factors" to improve the
wetting/diffusion of the eutectic solder paste into the high Sn solder
balls. The eutectic solder appears to wet well to the ENIG pads located
on the board but occasionally I see eutectic solder fillets that do not
always appear to fuse well with the high Sn content balls (if fuse is
the correct word?).  thx

 

 

Best Regards,

-Joe

 


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