Hi All,

 

My question is related to the soldering of IBM PPC CBGAs type components
(that have Sn90Pb10 solder balls) using Sn63 paste onto ENIG finished
boards.  What are the "determining-factors" to improve the
wetting/diffusion of the eutectic solder paste into the high Sn solder
balls. The eutectic solder appears to wet well to the ENIG pads located
on the board but occasionally I see eutectic solder fillets that do not
always appear to fuse well with the high Sn content balls (if fuse is
the correct word?).  thx

 

 

Best Regards,

-Joe

 


"This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message."
 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------