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February 2009

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From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Mon, 23 Feb 2009 09:06:50 -0700
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Yes and watch your AMEX card also.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Naisbitt
Sent: Friday, February 20, 2009 6:31 AM
To: [log in to unmask]
Subject: Re: [TN] Hot Slump

I know - but I am there looking after your interests...

...be afraid, very afraid

Graham N

On 20 Feb 2009, at 13:04, Bev Christian wrote:

> Yes, thank you Graham. I am actually a member of J-005, but have so  
> many committee conflicts I am having a hard time participating.
> Bev
>
> ----- Original Message -----
> From: Graham Naisbitt <[log in to unmask]>
> To: TechNet E-Mail Forum <[log in to unmask]>; Bev Christian
> Sent: Fri Feb 20 07:41:16 2009
> Subject: Re: [TN] Hot Slump
>
> Hi Bev and fellow Techies
>
> Yes it is being changed both for IPC and IEC.
>
> The recommended temperature for lead-free is presently under
> consideration at 180DegC.
>
> IPC-J-STD005 is under A Rev and the committee will be meeting to
> review some RR testing we are completing in time for APEX in Las  
> Vegas.
>
> I hope this helps
>
> Graham Naisbitt
> Gen3 Systems
>
> On 19 Feb 2009, at 20:41, Bev Christian wrote:
>
>> Technetters,
>> I would like your opinion on this.
>>
>> IPC-TM-650, Method 2.4.35 Solder Paste - Slump Test--1/95 states that
>> hot slump is measured after exposure to 150C for 10 to 15 minutes. Do
>> you think this should be changed for lead free solder pastes?
>> Bev
>> RIM
>>
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