Yes, thank you Graham. I am actually a member of J-005, but have so many committee conflicts I am having a hard time participating.
Bev
----- Original Message -----
From: Graham Naisbitt <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Bev Christian
Sent: Fri Feb 20 07:41:16 2009
Subject: Re: [TN] Hot Slump
Hi Bev and fellow Techies
Yes it is being changed both for IPC and IEC.
The recommended temperature for lead-free is presently under
consideration at 180DegC.
IPC-J-STD005 is under A Rev and the committee will be meeting to
review some RR testing we are completing in time for APEX in Las Vegas.
I hope this helps
Graham Naisbitt
Gen3 Systems
On 19 Feb 2009, at 20:41, Bev Christian wrote:
> Technetters,
> I would like your opinion on this.
>
> IPC-TM-650, Method 2.4.35 Solder Paste - Slump Test--1/95 states that
> hot slump is measured after exposure to 150C for 10 to 15 minutes. Do
> you think this should be changed for lead free solder pastes?
> Bev
> RIM
>
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